Copper cladding plays a very important role in the PCB production process. Sometimes the success or failure of copper cladding is related to the quality of the entire board. The so-called copper cladding is to fill solid copper into the idle space of the PCB substrate.

There are two methods of copper cladding: large area copper cladding and grid copper cladding. Large area copper cladding increases the current and shielding, but if it is wave soldered, the board may warp or even bubble. Grid copper cladding can reduce the heating surface of copper and play a certain role in electromagnetic shielding. However, the grid is composed of traces, and if the width of the traces is not appropriate, interference signals will be generated.

Copper cladding has many benefits for PCB, such as improving anti-noise capability, reducing potential difference, reducing ground wire impedance, improving anti-interference ability, reducing voltage drop, improving power supply efficiency, connecting to ground wire, reducing loop area, heat dissipation , reduce the impedance. Since there are so many benefits of copper cladding, what should be paid attention to when operating?

1. If there are many grounds on the PCB, such as SGND, AGND, GND, etc., it is necessary to use the most important "ground" as the reference reference to cover copper independently.

2. The crystal oscillator in the circuit is a high-frequency emission source, and the copper-clad nearby surrounds the crystal oscillator, and then the shell of the crystal oscillator is grounded separately.

3. Do not have sharp angles, that is, angles greater than 180°, otherwise a transmitting antenna will be formed.