TECHNICAL SKILLS

Engineering R&D

Sanlicheng Technology Co., Ltd. as "National High-Tech Enterprise" in LED PCB industry, always adhering to the meet customer quality requirements, continuously improve the technology content of printed circuit boards as own duty, has established the perfect R&D team and laboratory, from raw material incoming inspection, process control, to the finished product testing & final inspection, formed Sanlicheng technology unique scientific management research and development capabilities, also committed to product development, new materials and process improvement, to provide technical support for customers!

At present, the company achieved remarkable performance in the LED MINI COB & POB PCB, new aluminum pcb resin plug hole, countersink hole, aluminum super-conducting heat products, and some products have begun mass production!

Standard Items	Process Characteristics
Product type	Single-sided/double-sided/multilayer
Raw Material Product	Al/FR4/CEM3 &CEM1/Copper/iron base
Surface Treatment	HASL LEAD FREE & HASL LEADED/OSP/Immersion Gold
Maximum Product Size	1500X600 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Minimum Hole Size	0.3 mm
Board Thickness	0.4-8 mm
Outline CNC Tolerance	±3 mil
Outline PUNCH Tolerance	±4 mil
Copper Thickness	0.5-4 Oz
Thermal Conductiyity	1 -6 w/mk
Minimum DAM	75um
Minimum PAD Size	100um
Minimum PAD Tolerance	±10um
Plug Via	Resin plug / Solder mask plug
Solder Mask &Text Color	White/Black/Green/Yellow

MINI LED COB PCB Process Capability
NO.	Key Control Items	key devices	Luminum pcb single side	FR-4 double&single
1	Min LW/LS: Cu 1oz	LDI	0.05mm	0.05mm
2	Min COB Pad L*W @Cu1oz	LDI	0.10x0.1mm	0.10x0.1mm
3	Min COB PAD Gap	LDI	0.08mm	0.08mm
4	Min solder mask bridge	LDI	0.075mm	0.075mm
5	Mini board thickness	LDI	0.4mm	0.3mm
6	Pad L Tol.	LDI	±0.015mm	±0.015mm
7	Pad W Tol.	LDI	±0.015mm	±0.015mm
8	Gap of COB pad Tol.	LDI	±0.015mm	±0.015mm
9	Max PNL size	LDI	635x558 mm	635x558 m

Long Size Process Capability
NO.	Key Control Items	Single side Aluminum PCB
1	Mini LW @Cu 1oz	0.1 mm
2	Mini Pad L*W @Cu 1oz	0.25x0.50 mm
3	Min PAD Gap	0.1 mm
4	Min SM bridge	0.15 mm
5	Mini Board Thickness	0.6 mm
6	Pad L Tol.	±0.070 mm
7	Pad W Tol.	±0.070 mm
8	Gap of pad Tol.	±0.03 mm
9	Max PNL Size	1200mmx500 mm
10	Film coefficient	1200mm（±0.05mm）
11	Targeting Hole Tol.	±0.02 mm

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+86 181 2374 3147

No3, Hongyuan Road,Changchun Economic Development Zone,Ziyang,Yiyang 413000,Hunan